Hi Juan Camilo,

Welcome to HP's talent community! You are receiving this email because you have recently applied for a job we have posted and, as a result, you have been added to our talent community enabled by our Candidate Relationship Management (CRM) tool.

We invite you to tell us more about you by using the "Update your profile" link below.

By adding you as a member of HP's talent community of reinventors, we will be able to keep you informed about upcoming events and career opportunities. Our Talent Acquisition team will also be able to communicate with you regarding positions that may match your skills and experience. Any applications you have previously completed will not be affected by this—creating your profile just makes it easier to stay connected.

Information collected/you may be asked to provide include:
 
  • Contact information (name, email, phone number, physical address)
  • Employment areas of interest (type of position, industry, experience level)
  • Qualification details (such as resume, CV, cover letter, work experience, education)
  • Compensation expectations
  • Any other data you submit to us, including any correspondence between you and HP
 
 
 

You may also opt out and have your information removed from HP's community of reinventors.

You can read our full Job applicant privacy notice.

Requesting removal from HP's talent community will not impact any current or previous job specific employment applications you have submitted.

We strive to engineer experiences that amaze, and it is the creativity and innovation of our employees that make it happen.


Get connected to our global community of reinventors through our social media channels:

 

The HP Global Talent Acquisition team
 

 You are receiving this email because you applied to a job at HP and/or joined our talent community.
 If you'd like to discontinue receiving communications regarding career opportunities at HP, click here.
 To have your profile data completely removed from HP’s talent community, click remove my profile.
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